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23 Sept 2024, 09:08:43
Short summary description GENESIS SILICON 700 heat sink compound Thermal paste 8.3 W/m·K 2 g:
GENESIS SILICON 700, Thermal paste, 8.3 W/m·K, 1.6 g/cm³, Grey, 0.0014 °C/W, -30 - 240 °C
Long summary description GENESIS SILICON 700 heat sink compound Thermal paste 8.3 W/m·K 2 g:
GENESIS SILICON 700. Type: Thermal paste, Thermal conductivity: 8.3 W/m·K, Density: 1.6 g/cm³. Weight: 2 g. Quantity per pack: 1 pc(s), Package type: Blister
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